Perfrez® 6075D

Technical Datasheet
High Temperature Perfluoroelastomer for Plasma Applications
Our Perfrez 6075D is designed for performance excellence. Perfrez 6075D is specially developed to handle the rigorous requirements of aggressive fluorine and oxygen based plasma while generating
minimum particles. Perfrez 6075D offers a high purity solution for both static and dynamic applications such as etch, remote plasma cleans and deposition.

	Semiconductor Applications	Applications:
	Deposition: CVD, APCVD,	Chamber Lid Seals
	HDPCVD, RPCVD, SACVD	Door Seals
	Plasma Etch: oxide and metal	End Point Windows
	metal	Gas Inlet Seals
	Ashing	Isolator Valve Seals
	Ion Implant	Slit Valves
	Etch	Window Seals

Typical Physical Properties

**EVEN THOUGH ELONGATION PROPERTY IS INDICATED, MOST PERFLUROELASTOMER MATERIALS SHOULD NOT BE STRETCHED FOR OPTIMAL PERFORMANCE.
Note: color variations may be observed in parts. Variations are considered to be cosmetic and inherent as a result of curing process, not indicative for foreign matter and is not expected to have an adverse effect on the performance of the part in service.